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Odisha Launches India’s First Advanced 3D Chip Plant

Odisha Launches India’s First Advanced 3D Chip Plant Why in the News ? Odisha has laid the foundation for India’s first 3D semiconductor packaging plant under the India Semiconductor Mission (ISM), marking a major step in India’s semiconductor ambitions and high-tech manufacturing push. The project has received necessary environmental clearances following comprehensive regulatory assessments. Key …

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